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RIE-Systems by Aurion Anlagentechnik GmbH

Aurion Anlagentechnik GmbH

63500-D Seligenstadt
        14 Am Sandborn

+49 6182 96280

+49 6182 962816

RIE-Systems (Reactive Ion Etching)

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Based on a high level of knowledge and extensive experience in the field of high-frequency plasma processes, AURION has developed a series of RIE systems, which are characterized above all by flexibility and a very good price/performance ratio. The offer includes several system sizes for the most diverse substrates, throughputs and removal rates. Due to the high possible loading capacity (up to 25 wafers with Ø 150 mm or 20 wafers with Ø 200 mm) with a small footprint (max. 1.5 m² in the clean room), a throughput of more than 100,000 wafers per year can be achieved. This aspect is not only very interesting for companies with a small investment budget.


Activation of Plastic Surfaces

High degree of degreasing

Activate and clean surfaces



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