RIE-Systems

Based on a high level of knowledge and extensive experience in the field of high-frequency plasma processes, AURION has developed a series of RIE systems, which are characterized above all by flexibility and a very good price/performance ratio. The offer includes several system sizes for the most diverse substrates, throughputs and removal rates. Due to the high possible loading capacity (up to 25 wafers with Ø 150 mm or 20 wafers with Ø 200 mm) with a small footprint (max. 1.5 m² in the clean room), a throughput of more than 100,000 wafers per year can be achieved. This aspect is not only very interesting for companies with a small investment budget.

Coating

Activation of Plastic Surfaces

High degree of degreasing

Activate and clean surfaces