Plasma surface Technology for cleaning and modification as well as for coating and etching processes (PVD, PECVD, RIE, microwave).

Various methods of generating plasmas are used for this. The most common are the application of high-frequency AC voltages (40 kHz or 13.56 MHz) and excitation with microwaves. Typical gas mixtures include oxygen, argon, and sometimes hydrogen and carbon tetrafluoride (CF4). The mixture depends on the special requirements of the cleaning process, which result from the type of contamination and the material being treated. There are hardly any restrictions on the material to be cleaned. Temperature-sensitive plastics can be treated as well as metal, glass and ceramics. In any case, the plasma system must be adapted to the respective task. Depending on the gas mixture, the plasma has an oxidizing or reducing effect. Oxidizing plasmas are beneficial for removing organic contaminants (oils, greases), while reducing plasmas are more suitable for inorganic deposits (such as metal oxides). Almost every surface becomes dirty during various operations. For further treatment steps, such as painting, hardening or sealing, the workpieces must be cleaned. Plasma cleaning is the best way to get perfectly clean, grease-free surfaces. Classic cleaning methods are often wet-chemical and contain hydrocarbons (HC), chlorinated hydrocarbons (CFC) or harsh cleaning agents dissolved in water. All of these agents pose environmental problems both during use and when disposed of. Waste reduction is pursued with so-called end-of-pipe solutions, which incur additional costs. In contrast to wet chemistry, plasma cleaning meets the requirements for integrated environmental protection.

Etching with atmospheric pressure plasma

High degree of degreasing

High clearance