Sputtering Systems According to Customer Requirements

1. Vacuum Chamber: The entire process takes place inside a vacuum chamber to ensure that there are no contaminants interfering with the deposition process.
2. Target Material: The material to be deposited (the target) is mounted inside the vacuum chamber. It could be a metal, alloy, or compound depending on the desired properties of the thin film.
3. Substrate: The substrate, which is the material onto which the thin film will be deposited, is placed in close proximity to the target material. It can be made of glass, silicon, or other materials depending on the application.
4. Gas Supply: A small amount of inert gas, typically argon, is introduced into the vacuum chamber. This gas serves as the medium through which energy is transferred from a power source to the target material.
5. Power Supply: A high-voltage power supply is used to create a plasma discharge in the gas. This ionizes the gas and accelerates positively charged ions towards the target material.
6. Sputtering: When the positively charged ions from the plasma strike the surface of the target material, they transfer kinetic energy to the atoms of the target material, causing them to be ejected or sputtered from the target surface.
7. Deposition: The sputtered atoms travel across the vacuum chamber and deposit onto the substrate surface, forming a thin film with properties similar to the target material.
8. Film Thickness Control: The thickness of the deposited film can be controlled by adjusting parameters such as the sputtering time, the power of the plasma, and the distance between the target and substrate.
9. Film Composition Control: By using different target materials or by introducing reactive gases into the chamber, the composition of the deposited thin film can be controlled to achieve specific properties.

Coating

Surface Treatment

Activation of Plastic Surfaces

High degree of degreasing

Activate and clean surfaces